Prof. Shi-Wei Ricky Lee
Email: firstname.lastname@example.org; Tel: (020) 88335001
Ricky Lee received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University. He joined the Hong Kong University of Science & Technology (HKUST) in 1993. During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for three years. Currently Dr Lee is Chair Professor of Mechanical and Aerospace Engineering (MAE) and Director of HKUST Foshan Research Institute for Smart Manufacturing (FRISM) at HKUST. He also has concurrent appointments as Dean of Systems Hub of HKUST Guangzhou campus, Executive Director of HKUST Shenzhen Platform Development Office, and Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Dr Lee has been focusing his research on the development of packaging and assembly technologies for electronics and optoelectronics. His R&D activities cover wafer level packaging for heterogeneous integration, additive manufacturing for microsystems, LED packaging, and reliability engineering. The research outcomes of Dr Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored 3 books and 9 book chapters. Due to his technical contributions, Dr Lee received many honours and awards over the years. Dr Lee is Life Fellow of ASME and IMAPS, and Fellow of IEEE and Institute of Physics (UK). He also serves as Editor-in-Chief of ASME Journal of Electronic Packaging.
Prof. Baoling Huang
Email: email@example.com Tel: (852) 2358 7181
Prof Huang received his B.S. and M.S. degrees in Engineering Thermophysics from Tsinghua University, Beijing, China in 1999 and 2001. He worked in industry from 2001 to 2004. In 2008, he received his Ph.D. degree in Mechanical Engineering from the University of Michigan, Ann Arbor, USA. After graduation, he worked as a postdoctoral research fellow at the University of California, Berkeley and Lawrance Berkeley National Laboratory. He joined the Hong Kong University of Science and Technology in 2010. He has research experience in both theoretical modeling and experimental fabrications/measurements. His research interests are in the broad area of energy transport, conversion and storage.